Electroninks to present spray-deposited silver BSM data at IMAPS 2026

Electroninks will present new data at IMAPS Symposium 2026 on spray-deposited silver backside metallization for indium thermal interface material integration. The company says the process meets production reliability standards while enabling scalable atmospheric processing for RF and logic packaging.

Why it matters: - Electroninks is targeting a packaging bottleneck in high-power semiconductors: backside metallization that can support indium thermal interface material bonding without sacrificing reliability. - The approach is positioned for RF modules, logic devices and AI accelerators, where thermal dissipation and interfacial reliability are increasingly critical. - Electroninks says the process could reduce capital equipment needs by avoiding vacuum tools and improving throughput for large-area wafer and panel processing.

What happened: - Electroninks said it will present new performance data on spray-deposited silver backside metallization for indium metal thermal interface material integration at IMAPS Symposium 2026. - Dr. Kang-Yu Liu, Taiwan Application Development Manager at Electroninks, will present the session on Wednesday, Sept. 30, at 4 p.m. in Cezanne 1-2 at Encore Boston Harbor in Boston. - Electroninks will also exhibit at booth #418. - More information is available on Electroninks' website.

The details: - The presentation covers a production-oriented spray-deposited metal-organic decomposition silver ink for backside metallization. - Electroninks and ASE jointly evaluated the material for compatibility with indium-based metal TIM bonding. - The study focused on RF module and logic device applications. - The silver MOD ink was spray coated onto silicon substrates and formed a conductive, dense film with strong adhesion. - The film was evaluated for uniformity, adhesion, conductivity, migration and diffusion behavior, and reliability. - The material passed Moisture Sensitivity Level and Thermal Cycling Test qualification. - The spray-deposited MOD silver approach enables atmospheric processing with no vacuum equipment. - The process improves surface conformity across die and panel geometries. - The method supports scalable, tunable film thickness control. - The bonding performance with indium TIM is comparable to or better than conventional backside metallization, according to Electroninks.

Between the lines: - The collaboration with ASE signals an effort to move the process from lab validation toward production use. - The pitch is as much about manufacturing economics as materials performance, with lower capital constraints and broader process scalability as key selling points. - As packaging density rises, backside metallization is shifting from a supporting step to a core design constraint.

What's next: - Electroninks will use the IMAPS presentation to show production-ready reliability data to packaging engineers and potential customers. - The company appears to be aiming for adoption in next-generation RF and logic packaging where atmospheric, additive processing could replace more capital-intensive workflows. - Continued interest will likely depend on how well the process performs in high-volume manufacturing environments beyond qualification testing.

The bottom line: - Electroninks is betting spray-deposited silver can deliver the reliability of conventional backside metallization with a simpler, more scalable manufacturing path.